The new Qualcomm QCC305x series of chips for TWS headphones has received support for Bluetooth LE Audio

Qualcomm has introduced a new series of mid-budget TWS headphone chips. The QCC305x line features full support for the Bluetooth LE Audio audio standard.

In addition, the chip supports the low-power Qualcomm Adaptive ANC digital noise cancellation technology, which the company talked about in early autumn, as well as the TrueWireless Mirroring function and the activation of voice assistants by speech.

According to the company, the new series of chips will offer manufacturers a wide range of options and functionality for use in fully wireless headphones – all in the mid-price segment. Full support for the Bluetooth LE Audio protocol will also allow manufacturers to start developing devices that will work according to this standard in a timely manner.

Bluetooth LE Audio will soon become a new standard in the industry, expanding the functionality of wireless audio transmission: with it will come such functions as broadcasting, connecting to multiple sources or multiple receivers, and transferring signals from one headphone to another.

Other technologies in the new series of chips include support for the aptX Adaptive codec, as well as aptX Voice, cVc Echo Cancellation and Noise Suppression to provide better voice transmission.